PM-500 SE系列
PM-500 SEG10是专门用于塞孔的绿色阻焊材料，适用于汽车板等要求较高PCB的塞孔工艺。易塞孔，固化后无气泡、不开裂。重涂性好，面油不分层、高温不起泡。符合欧盟RoHS及低卤要求。
PM-500 SEG10green Solder Mask for plug hole, Applicable for AUTO PCB plug hole. Easy to plug hole, no bubble, no crack after curing. Good recoating, Good adhesion. Environmentally Friendly: RoHS, Halogen Free.
一、物性General properties
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1 |
主剂Main agent |
PM-500 SEG10 |
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2 |
固化剂Hardener |
H-50 HAS9 |
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3 |
颜色Color |
Green 绿色 |
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4 |
主剂粘度 Main agent’s Viscosity (at 25℃) |
350±50dPa.s |
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5 |
固化剂粘度 Hardener’s Viscosity (at 25℃) |
70±10dPa.s |
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6 |
混合比例 Mixing ratio |
主剂Main agent：固化剂Hardener=7:3 |
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7 |
混合后粘度 Viscosity after mixed (at 25℃) |
250±50dPa.s |
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8 |
混合后固体含量Non-volatile % after mixed |
90±2% |
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9 |
混合后比重Specific gravity after mixed |
1.4±0.05 |
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10 |
保存期限Shelf life |
6个月/ 6 month after production |
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11 |
包装规格Package |
1Kg/Cans（罐），10Kg/Box（箱） |
二、应用操作指引
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基板表面处理 |
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化学处理，浮石粉或火山灰处理，市水冲洗干净 |
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↓ |
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开油 |
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主剂与固化剂按3：1混合，添加适量稀释剂，搅拌或震荡5-10分钟。 |
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↓ |
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静置 |
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10-20分钟，使油墨充分排出开油时产生的气泡，但不超过24小时。 |
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↓ |
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塞孔印刷 |
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专用铝片网或图形丝网，厚度18mm刮胶印刷。 清洁筛网避开其他油墨污染，室温20-25℃，湿度小于60%RH 印刷厚度要求湿膜在38-45um，干燥后25-30um。 |
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↓ |
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面油印刷 |
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第一面印刷焊接面，第二面印刷零件面；36T或者43T网印刷。 清洁筛网避开其他油墨污染，室温20-25℃，湿度小于60%RH 印刷厚度要求湿膜在38-45um，干燥后25-30um。 |
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↓ |
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静置 |
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20分钟以上，板材铜箔越厚，静置时间应越长，但不超过4个小时。 |
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↓ |
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预烤 |
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两面分别印刷、分别烘烤 第一面热风循环烤箱：温度70-75℃，时间10-20分钟 第二面热风循环烤箱：温度70-75℃，时间15-30分钟 两面同时印刷、同时烘烤 热风循环烤箱：温度70-75℃，时间15-40分钟 |
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↓ |
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冷却叠板 |
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放置20分钟以上使板材充分冷却，但停放时间不超过24小时。 叠板不易过多，叠板压力不超过40 mmHg |
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↓ |
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曝光 |
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曝光能量一般在400-1000mj/cm2 ，使用21级曝光尺保持感度在10-12格之间 |
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↓ |
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静置 |
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20分钟以上，但不超过24小时 |
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↓ |
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显像 |
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压力2.0-2.5kg/cm2浓度1wt% Na2CO3，液温30±2℃，显像时间70-90秒 过显影缸后，再用2.5-3.0kg/cm2喷淋压力25℃左右的市水清洗45-60秒，使用2组以上海棉轮吸水，40℃以上热风吹干 |
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↓ |
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热固化 |
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75℃×60分钟+100℃×30分钟+120℃×30分钟+150℃×60分钟 |
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↓ |
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丝印字符 |
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丝网印刷设备及固化条件依字符油墨操作条件 |
Processing instructions
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Pre-treatment |
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Chemical treatment，Pumice scrub or Buff (over #1000) treatment Rinse with distilled water |
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↓ |
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Mixing |
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Main agent and hardener agent in 7:3 mix, add appropriate thinner, shock 5-10 minutes |
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↓ |
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Hold time |
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Hold time: within 20min after printing, But not more than 24 hours |
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↓ |
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Plug hole |
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Aluminum mesh, 18mm plastic printing. Clean screen mesh to avoid other ink contamination. Room temperature: 20-25℃, Room humidity: under 60%RH. Printing wet film thickness requirements in more than 38-45 um, and above 25-30 um after drying. |
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↓ |
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Coating |
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Screen printing by 36-43T polyester screen. |
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↓ |
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Hold time |
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Hold time: within 20min after printing, But not more than 4 hours |
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↓ |
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Pre-cure |
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First side: by hot air dryer at 70-75℃ for 10-20min Back side: by hot air dryer at 70-75℃ for 15-30min Both side: by hot air dryer at 70-75℃ for 15-40min |
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↓ |
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Laminate mask film |
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Hold 12-30min to cool down enough Laminate mask film in vacuum under 40 mmHg |
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↓ |
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Exposure |
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400-1000mj/cm2 (on resist surface) to 10-12 level vacuum under 650 mmHg |
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↓ |
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Hold time |
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Hold 20 min after exposure，But not more than 24hours |
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↓ |
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Developing |
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By 2.0-2.5kg/cm2 Spraying of 1wt% Na2CO3 at 30±2℃ for 60-90sec Rinsing by 2.5-3.0kg/cm2 spraying of water at below 25℃ for 45-60sec Taking off rinsing water by sponge roll and drying by hot air at 40℃ for several minutes |
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↓ |
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Post cure |
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75℃*60min+100℃*30min+120℃*30min+150℃*60min |
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↓ |
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Screen print Marking ink |
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Screen printing and curing condition depend upon marking specification |
三、Coating properties涂膜特性（IPC-SM-840E）
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要求Requirement |
测试方法Test Method |
结果Result |
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防霉性Nonnutrient |
IPC-TM-650 2.6.1 |
OK |
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表面状况Visual Requirements |
IPC-SM-840E 3.3.1 |
OK |
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铅笔硬度Pencil Hardness |
ASTM D3363 |
OK |
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附着力（硬板）Adhesion of RPB |
IPC-TM-650 2.4.28.1 |
OK |
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可加工性Mach inability |
IPC-TM-650 2.4.7.1 |
OK |
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耐溶剂和清洗剂 Resistance to Solvents and Cleaning Agents |
IPC-TM-650 2.3.42 涂膜无分离、裂纹、粘着 Coating shall not exhibit delamination, cracks, tackiness, swelling or permanent degradation |
OK |
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耐化学试剂 Resistance to Assembly Processes and Chemistry |
IPC-SM-840E 3.6.1.2 10vol% H2SO4 20℃ 30min 10wt% NaOH 20℃ 30min |
OK |
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水解稳定性 Hydrolytic Stability |
IPC-TM-650 2.6.11 |
OK |
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阻燃性Flammability |
UL94 V0 E343546 |
OK |
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可焊性Solder ability |
J-STD-003 260±5℃*10±1秒 |
OK |
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耐焊性 Resistance to Solder
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IPC-TM-650 2.6.8 Flux shall be a ROM0 or ROM1 per J-STD-004 助焊剂应依据J-STD-004，使用ROM0或ROM1 浮锡 Solder Float 260±5℃*10±1秒 |
OK |
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Simulation of Lead Free Reflow 无铅回流焊模拟 |
IPC-SM-840E 3.7.3.1 浮锡Solder Float 260±5℃*10±1秒*5次 |
OK |
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介电强度Dielectric Strength |
IPC-TM-650 2.5.6.1 |
1000 V DC/mil |
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绝缘电阻Insulation Resistance |
IPC-TM-650 2.6.3.1 |
≧7.0×1012Ω |
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耐湿绝缘电阻Moisture and Insulation Resistance |
IPC-TM-650 2.6.3.1 |
≧5.0×108Ω |
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电迁移Electrochemical Migration |
IPC-TM-650 2.6.14 |
OK |
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冷热冲击Thermal Shock |
IPC-TM-650 2.6.7.3 -65℃ to +125℃ *100 Cycles -65℃ 到 +125℃ *100次 |
OK |
备注：此资料为本公司试验结果，不作为保证之用。适宜之条件，需参照技术资料，待贵公司实施确认后，再予以确定。
PS: This information is our test results, not as a guarantee. The suitable condition, need to consult technical data, to be your company carry out confirmation, to be determined.
