PM-500 K系列
PM-500 K系列是双组份液态感光黑色阻焊材料，适应于丝网印刷。
是IC载板特别开发的高阶产品，其最小隔线能力达到3mil，侧蚀可控制在15um以内。具有低曝光量、耐长时间显影之特性。油墨流平性能好，表面易整平。
能够满足化锡、化金、无铅喷锡等各种表面处理制程。
本产品符合欧盟RoHS和低卤要求。
PM-500 K series is dual component type liquid photoimageable black solder mask，Applicable for screen printing.
Applicable for IC substrate PCB, It is easy to make 2 mil Solder dam.Under-cut can be controlled within 15um. Mask surface leveling
Applicable for OSP、HASL、ENIG、IMT.
Comply with EU RoHS and Low halogen.
一、物性General properties
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1 |
主剂Main agent |
PM-500 K系列 |
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固化剂Hardener |
H-50 A8 |
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颜色Color |
黑色Black |
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4 |
主剂粘度Main agent’s Viscosity (at 25℃) |
240-280P |
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固化剂粘度Hardener’s Viscosity (at 25℃) |
100-150P |
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6 |
混合比例Mixing ratio |
主剂Main agent：固化剂Hardener=3：1 |
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混合后粘度Viscosity after mixed (at 25℃) |
160±20dPa.s |
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8 |
混合后固体含量Non-volatile % after mixed |
78±3% |
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混合后比重Specific gravity after mixed |
1.4±0.05 |
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保存期限Shelf life |
6个月/ 6 month after production |
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包装规格Package |
1Kg/Cans（罐），10Kg/Box（箱） |
二、应用操作指引
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基板表面处理 |
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化锡板推荐使用超粗化 化金板、塞孔板、塞连印板推荐使用超粗化、火山灰 OSP板、喷锡板使用超粗化、火山灰、喷砂或磨刷均可 |
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开油 |
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主剂与固化剂按比例混合，添加适量稀释剂，搅拌或震荡10分钟。 |
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静置 |
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20分钟以上，使油墨充分排出开油时产生的气泡，但不超过24小时。 |
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印刷 |
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第一面印刷焊接面，第二面印刷零件面；36T或者43T网印刷。 清洁筛网避开其他油墨污染，室温20-25℃，湿度45-60%RH 印刷厚度要求湿膜在38-45um，干燥后25-30um。 |
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静置 |
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20分钟以上，板材铜箔越厚，静置时间应越长，但不超过2个小时。 |
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预烤 |
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两面分别印刷、分别烘烤 第一面热风循环烤箱：温度70-75℃，时间10-20分钟 第二面热风循环烤箱：温度70-75℃，时间25-30分钟 两面同时印刷、同时烘烤 热风循环烤箱：温度70-75℃，时间35-55分钟 |
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冷却 |
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放置20分钟以上使板材充分冷却，但停放时间不超过24小时。 |
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曝光 |
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曝光能量一般在300-500mj/cm2 ，使用21级曝光尺保持感度在9-12格之间 |
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静置 |
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20分钟以上，但不超过24小时 |
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显像 |
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压力2.0-2.5kg/cm2浓度1wt% Na2CO3，液温30±2℃，显像时间60-120秒 过显影缸后，再用1.5-2.0kg/cm2喷淋压力25℃左右的市水清洗60-100秒，使用2组以上海棉轮吸水，40℃以内热风吹干 |
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热固化 |
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沉金板、沉锡板：150℃×50分钟； 抗氧化板、喷锡板：150℃×60分钟； 厚铜板（2OZ及以上）分段烤：第一段75℃×120分钟、第二段100℃×30分钟、第三段150℃×60分钟 两机作业塞孔板：第一段65℃×60分钟、第二段80℃×30分钟、第三段100℃×30分钟、第四段120℃×30分钟、第五段150℃×60分钟 |
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丝印字符 |
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丝网印刷设备及固化条件依字符油墨操作条件 |
Processing instructions
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Pre-treatment |
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IMT recommended use superbond ENIG, Plug Hole or recommended use superbond 、Pumice OSP，HASL can be superbond, pozzolana, sand blast or polish-brush |
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Mixing |
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Main agent and hardener are mixed in proportion, add appropriate thinner, stir 10 MIN |
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Hold time |
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More than 20 minutes, but not more than 24 hours |
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Coating |
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Screen printing by 36-43T polyester screen. Clean screen mesh to avoid other ink contamination. Room temperature: 20-25℃, Room humidity: 45-60%RH. Printing wet film thickness requirements in more than 38-45 um, and above 25-30 um after drying. |
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Hold time |
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More than 20 minutes after printing, But not more than 2 hours |
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Pre-cure |
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First side: by hot air dryer at 70-75℃ for 10-20min Back side: by hot air dryer at 70-75℃ for 15-30min Both side: by hot air dryer at 70-75℃ for 35-55min |
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Cooling |
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Hold more than 20 minutes to cool down enough, But not more than 24 hours |
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Exposure |
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300-500mj/cm2 (on resist surface) to 9-12 level
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Hold time |
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Hold 20 min after exposure，But not more than 24hours |
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Developing |
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By 2.0-2.5kg/cm2 Spraying of 1wt% Na2CO3 at 30±2℃ for 60-120sec Rinsing by 1.5-2.0kg/cm2 spraying of water at below 25℃ for 60-100sec Taking off rinsing water by sponge roll and drying by hot air at 40℃ for several minutes |
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Post cure |
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ENIG、IMT ：150℃×50 MIN； OSP、HASL：150℃×60 MIN； Heavy copper PCB（more than 2OZ）：75℃×120MIN+100℃×30MIN+150℃×60MIN Plug Hole PCB：65℃×60MIN+80℃×30MIN+100℃×30MIN+120℃×30MIN+150℃×60MIN |
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Screen print Marking ink |
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Screen printing and curing condition depend upon marking specification |
三、Coating properties涂膜特性（IPC-SM-840E）
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要求Requirement |
测试方法Test Method |
结果Result |
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防霉性Nonnutrient |
IPC-TM-650 2.6.1 |
OK |
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表面状况Visual Requirements |
IPC-SM-840E 3.3.1 |
OK |
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铅笔硬度Pencil Hardness |
ASTM D3363 |
OK |
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附着力（硬板）Adhesion of RPB |
IPC-TM-650 2.4.28.1 |
OK |
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可加工性Mach inability |
IPC-TM-650 2.4.7.1 |
OK |
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耐溶剂和清洗剂 Resistance to Solvents and Cleaning Agents |
IPC-TM-650 2.3.42 涂膜无分离、裂纹、粘着 Coating shall not exhibit delamination, cracks, tackiness, swelling or permanent degradation |
OK |
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耐化学试剂 Resistance to Assembly Processes and Chemistry |
IPC-SM-840E 3.6.1.2 10vol% H2SO4 20℃ 30min 10wt% NaOH 20℃ 30min |
OK |
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水解稳定性 Hydrolytic Stability |
IPC-TM-650 2.6.11 |
OK |
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阻燃性Flammability |
UL94 V0 E343546 |
OK |
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可焊性Solder ability |
J-STD-003 260±5℃*10±1秒 |
OK |
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耐焊性 Resistance to Solder
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IPC-TM-650 2.6.8 Flux shall be a ROM0 or ROM1 per J-STD-004 助焊剂应依据J-STD-004，使用ROM0或ROM1 浮锡 Solder Float 260±5℃*10±1秒 |
OK |
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Simulation of Lead Free Reflow 无铅回流焊模拟 |
IPC-SM-840E 3.7.3.1 浮锡Solder Float 260±5℃*10±1秒*5次 |
OK |
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介电强度Dielectric Strength |
IPC-TM-650 2.5.6.1 |
1000 V DC/mil |
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绝缘电阻Insulation Resistance |
IPC-TM-650 2.6.3.1 |
≧7.0×1012Ω |
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耐湿绝缘电阻Moisture and Insulation Resistance |
IPC-TM-650 2.6.3.1 |
≧5.0×108Ω |
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电迁移Electrochemical Migration |
IPC-TM-650 2.6.14 |
OK |
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冷热冲击Thermal Shock |
IPC-TM-650 2.6.7.3 -65℃ to +125℃ *100 Cycles -65℃ 到 +125℃ *100次 |
OK |
备注：此资料为本公司试验结果，不作为保证之用。适宜之条件，需参照操作指引，待贵公司实施确认后，再予以确定。
PS: This information is our test results, not as a guarantee. The suitable condition, need to consult Processing instructions, to be your company carry out confirmation, to be determined.
若英文内容与中文内容有差异，以中文为准。
In case of any discrepancy between the English and Chinese content, the Chinese version shall prevail.
