PM-500 PT系列阻焊喷涂油墨
PM-500 PTG-05双组份液态感光防焊油墨，静电喷涂或水平低压喷涂使用。耐热性好，耐化金性能好。低卤素，符合RoHS和低卤要求。最重要的特性是侧蚀小，可以制做4MIL隔焊线；耐擦花优于同类产品。
PM-500 PTG-05 is dual component type liquid photoimageable solder mask for PCB ，for Electrostatic spraying or horizontal low-pressure spraying. Excellent Heat resistance, Excellent Au plating resistance, Non-Halogen and accord with RoHS and Low halogen,Small undercut, can make 4 MIL line; Scratch resistant is superior to similar products.
一、物性General properties
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1 |
主剂Main agent |
PM-500 PTG-05 |
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2 |
固化剂Hardener |
H-50 HP2 |
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3 |
颜色Color |
绿色Green |
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4 |
主剂粘度Main agent’s Viscosity (at 25℃) |
150-200P |
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固化剂粘度Hardener’s Viscosity (at 25℃) |
50-100P |
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6 |
混合比例Mixing ratio |
主剂Main agent：固化剂Hardener=86：14 |
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7 |
混合后粘度Viscosity after mixed (at 25℃) |
120±20dPa.s |
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8 |
混合后固体含量Non-volatile % after mixed |
78±3% |
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混合后比重Specific gravity after mixed |
1.4±0.05 |
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保存期限Shelf life |
6个月/ 6 month after production |
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包装规格Package |
1Kg/Cans（罐），10Kg/Box（箱） |
二、应用操作指引
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基板表面处理 |
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化锡板推荐使用超粗化 化金板推荐使用超粗化、火山灰或喷砂 OSP板和喷锡板可以使用超粗化、火山灰、喷砂或磨刷 |
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开油 |
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主剂与固化剂按3：1混合，添加适量稀释剂，搅拌5-10分钟。静电喷涂，预喷粘度一般控制在25秒，主喷粘度一般控制在50秒。水平低压喷涂粘度一般控制在40-60秒，依客户设备需要。 |
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静置 |
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10-20分钟，使油墨充分排出开油时产生的气泡，但不超过24小时。 |
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喷涂 |
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走板速度及喷枪压力等条件，依厂商要求。 |
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预烤 |
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普通隧道炉：温度70-75℃，时间40-45分钟 红外隧道炉：各公司可以根据自已设备情况，主要温度可以控制在80-120℃之 间，时间在2-5分钟之间依需要调整。 以常用六段温区炉为例，可分段设为85℃-95℃-95℃-95℃-95℃-70℃，速度 3.5-4m/min，时间4-5分钟 |
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冷却 |
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放置20分钟以上使板材充分冷却，但停放时间不超过24小时。 |
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曝光 |
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曝光能量一般在400-1000mj/cm2 ，使用21级曝光尺保持感度在10-12格之间 |
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静置 |
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20分钟以上，但不超过24小时 |
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显像 |
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压力2.0-2.5kg/cm2浓度1wt% Na2CO3，液温30±2℃，显像时间70-90秒 过显影缸后，再用2.5-3.0kg/cm2喷淋压力25℃左右的市水清洗45-60秒，使用2组以上海棉轮吸水，40℃以上热风吹干 |
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热固化 |
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沉金板、沉锡板：150℃×50分钟； 抗氧化板、喷锡板：150℃×60分钟； 厚铜板（2OZ及以上）分段烤：第一段75℃×120分钟、 第二段100℃×30分钟、第三段150℃×60分钟 |
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丝印字符 |
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丝网印刷设备及固化条件依字符油墨操作条件 |
Processing instructions
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Pre-treatment |
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IMT recommended use superbond ENIG recommended use superbond 、pozzolana or sand blast OSP and HASL can be superbond, pozzolana, sand blast or polish-brush |
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Mixing |
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Main agent and hardener agent in 3:1 mix, add appropriate thinner, stir or shock 5-10 minutes. Electrostatic spraying, pre-spray viscosity is generally controlled in 25 seconds, the main spray viscosity is generally controlled in 50 seconds. The viscosity of horizontal low-pressure spraying is generally controlled in 40-60 seconds, depending on the needs of customer equipment.. |
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Hold time |
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Hold time: within 20min after printing, But not more than 24 hours |
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Spraying |
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Transfer speed、Sprayer stress、Sprayer calibration in accordance with the equipment requirements |
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Pre-cure |
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Normal tunnel oven: 70-75℃, time of 40-45 minutes IR tunnel oven: You can according to your equipment condition, main temperature can be controlled between 80-120, the time between 2-5 minutes EXP: six zones IR tunnel oven, setting 85 ℃ -95 ℃-95 ℃-95 ℃ -95 ℃-70 ℃, speed 3.5- 4 m/min, times: 4 to 5 min |
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Laminate mask film |
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Hold 12-30min to cool down enough Laminate mask film in vacuum under 40 mmHg |
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Exposure |
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400-1000mj/cm2 (on resist surface) to 10-12 level vacuum under 650 mmHg |
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Hold time |
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Hold 20 min after exposure，But not more than 24hours |
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Developing |
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By 2.0-2.5kg/cm2 Spraying of 1wt% Na2CO3 at 30±2℃ for 60-90sec Rinsing by 2.5-3.0kg/cm2 spraying of water at below 25℃ for 45-60sec Taking off rinsing water by sponge roll and drying by hot air at 40℃ for several minutes |
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Post cure |
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Cure resist film thoroughly by hot air dryer at 150℃ for 50-60min （ENIG、IMT for 50 min ；OSP、HASL for 60 min） |
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Screen print Marking ink |
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Screen printing and curing condition depend upon marking specification |
三、Coating properties涂膜特性（IPC-SM-840E）
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要求Requirement |
测试方法Test Method |
结果Result |
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防霉性Nonnutrient |
IPC-TM-650 2.6.1 |
OK |
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表面状况Visual Requirements |
IPC-SM-840E 3.3.1 |
OK |
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铅笔硬度Pencil Hardness |
ASTM D3363 |
OK |
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附着力（硬板）Adhesion of RPB |
IPC-TM-650 2.4.28.1 |
OK |
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可加工性Mach inability |
IPC-TM-650 2.4.7.1 |
OK |
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耐溶剂和清洗剂 Resistance to Solvents and Cleaning Agents |
IPC-TM-650 2.3.42 涂膜无分离、裂纹、粘着 Coating shall not exhibit delamination, cracks, tackiness, swelling or permanent degradation |
OK |
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耐化学试剂 Resistance to Assembly Processes and Chemistry |
IPC-SM-840E 3.6.1.2 10vol% H2SO4 20℃ 30min 10wt% NaOH 20℃ 30min |
OK |
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水解稳定性 Hydrolytic Stability |
IPC-TM-650 2.6.11 |
OK |
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阻燃性Flammability |
UL94 V0 E343546 |
OK |
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可焊性Solder ability |
J-STD-003 260±5℃*10±1秒 |
OK |
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耐焊性 Resistance to Solder
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IPC-TM-650 2.6.8 Flux shall be a ROM0 or ROM1 per J-STD-004 助焊剂应依据J-STD-004，使用ROM0或ROM1 浮锡 Solder Float 260±5℃*10±1秒 |
OK |
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Simulation of Lead Free Reflow 无铅回流焊模拟 |
IPC-SM-840E 3.7.3.1 浮锡Solder Float 260±5℃*10±1秒*5次 |
OK |
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介电强度Dielectric Strength |
IPC-TM-650 2.5.6.1 |
1000 V DC/mil |
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绝缘电阻Insulation Resistance |
IPC-TM-650 2.6.3.1 |
≧7.0×1012Ω |
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耐湿绝缘电阻Moisture and Insulation Resistance |
IPC-TM-650 2.6.3.1 |
≧5.0×108Ω |
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电迁移Electrochemical Migration |
IPC-TM-650 2.6.14 |
OK |
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冷热冲击Thermal Shock |
IPC-TM-650 2.6.7.3 -65℃ to +125℃ *100 Cycles -65℃ 到 +125℃ *100次 |
OK |
备注：此资料为本公司试验结果，不作为保证之用。适宜之条件，需参照操作指引，待贵公司实施确认后，再予以确定。
PS: This information is our test results, not as a guarantee. The suitable condition, need to consult Processing instructions, to be your company carry out confirmation, to be determined.
若英文内容与中文内容有差异，以中文为准。
In case of any discrepancy between the English and Chinese content, the Chinese version shall prevail.
