PM-500 DI系列
PM-500 FW01DI是挠性板专用双组份白色液态感光阻焊材料，采用丝网印刷，适用于DI曝光工艺。耐热性好，耐化金性能好。低卤素，符合RoHS和REACH要求。且黄变性优良，反射率80%以上。
PM-500 FW01DI is a special two-component white liquid photosensitive anti-welding Solder Mask for FPC. It is screen printed and suitable for DI exposure process.Good heat resistance, good resistance to gold.Low halogen, meeting RoHS and REACH requirements.And yellow denaturation is good, reflectivity above 80%.
一、物性General properties
|
1 |
主剂Main agent |
PM-500 FW01DI |
|
2 |
固化剂Hardener |
H-50 FWH2 |
|
3 |
颜色Color |
白色 White |
|
4 |
主剂粘度 Main agent’s Viscosity (at 25℃) |
240-280P |
|
5 |
固化剂粘度 Hardener’s Viscosity (at 25℃) |
70-130P |
|
6 |
混合比例Mixing ratio |
主剂Main agent：固化剂 Hardener=85：15 |
|
7 |
混合后粘度 Viscosity after mixed (at 25℃) |
160±20dPa.s |
|
8 |
混合后固体含量 Non-volatile % after mixed |
78±3% |
|
9 |
混合后比重 Specific gravity after mixed |
1.2±0.05 |
|
10 |
黄变性color change (IR 270℃ Thickness 25um) |
∆E<1.5 |
|
11 |
反射率Reflectivity at 450nm (Thickness 25um) |
80-85% |
|
12 |
保存期限Shelf life |
6个月/ 6 month after production |
|
13 |
包装规格Package |
1Kg/Cans（罐），10Kg/Box（箱） |
|
14 |
曝光能量Exposure energy |
以21级曝光尺为准感度9-12格 The sensitivity is 9-12 grids according to the 21-level exposure rule |
- 应用操作指引
|
基板表面处理 |
|
中粗化或微蚀化学处理，市水冲洗干净 |
|
↓ |
|
|
|
开油 |
|
主剂与固化剂按85：15混合，添加适量稀释剂，搅拌或震荡5-10分钟。 |
|
↓ |
|
|
|
静置 |
|
10-20分钟，使油墨充分排出开油时产生的气泡，但不超过24小时。 |
|
↓ |
|
|
|
印刷 |
|
36T或者43T网印刷 清洁筛网避开其他油墨污染，室温20-25℃，湿度小于60%RH 印刷厚度要求湿膜在30-40um，干燥后20-25um。 |
|
↓ |
|
|
|
静置 |
|
20分钟以上，板材铜箔越厚，静置时间应越长，但不超过4个小时。 |
|
↓ |
|
|
|
预烤 |
|
两面分别印刷、分别烘烤 第一面热风循环烤箱：温度70-75℃，时间10-20分钟 第二面热风循环烤箱：温度70-75℃，时间15-30分钟 |
|
↓ |
|
|
|
冷却叠板 |
|
放置20分钟以上使板材充分冷却，但停放时间不超过24小时。 叠板不易过多，叠板压力不超过40 mmHg |
|
↓ |
|
|
|
曝光 |
|
以21级曝光尺为准感度9-12格 |
|
↓ |
|
|
|
静置 |
|
20分钟以上，但不超过24小时 |
|
↓ |
|
|
|
显像 |
|
压力2.0-2.5kg/cm2浓度1wt% Na2CO3，液温30±2℃，显像时间70-90秒 过显影缸后，再用2.5-3.0kg/cm2喷淋压力25℃左右的市水清洗45-60秒，使用2组以上海棉轮吸水，40℃以上热风吹干 |
|
↓ |
|
|
|
热固化 |
|
普通板：150℃×60分钟 厚铜板（2OZ及以上）：第一段75℃×120分钟、 第二段100℃×30分钟、第三段150℃×60分钟 |
|
↓ |
|
|
|
丝印字符 |
|
丝网印刷设备及固化条件依字符油墨操作条件 |
Processing instructions
|
Pre-treatment |
|
Copper surface roughening treatment Rinse with distilled water |
|
↓ |
|
|
|
Mixing |
|
Main agent and hardener agent in 85:15mix, add appropriate thinner, stir or shock 5-10 minutes |
|
↓ |
|
|
|
Hold time |
|
Hold time: within 20min after printing, But not more than 24 hours |
|
↓ |
|
|
|
Coating |
|
Screen printing by 36-43T polyester screen. Clean screen mesh to avoid other ink contamination. Room temperature: 20-25℃, Room humidity: under 60%RH. Printing wet film thickness requirements in more than 30-40 um, and above 20-25 um after drying. |
|
↓ |
|
|
|
Hold time |
|
Hold time: within 20min after printing, But not more than 4 hours |
|
↓ |
|
|
|
Pre-cure |
|
First side: by hot air dryer at 70-75℃ for 10-20min Back side: by hot air dryer at 70-75℃ for 15-30min Both side: by hot air dryer at 70-75℃ for 15-40min |
|
↓ |
|
|
|
Laminate mask film |
|
Hold 12-30min to cool down enough Laminate mask film in vacuum under 40 mmHg |
|
↓ |
|
|
|
Exposure |
|
The sensitivity is 9-12 grids according to the 21-level exposure rule |
|
↓ |
|
|
|
Hold time |
|
Hold 20 min after exposure，But not more than 24hours |
|
↓ |
|
|
|
Developing |
|
By 2.0-2.5kg/cm2 Spraying of 1wt% Na2CO3 at 30±2℃ for 60-90sec Rinsing by 2.5-3.0kg/cm2 spraying of water at below 25℃ for 45-60sec Taking off rinsing water by sponge roll and drying by hot air at 40℃ for several minutes |
|
↓ |
|
|
|
Post cure |
|
Cure resist film thoroughly by hot air dryer at 150℃ for 60min |
|
↓ |
|
|
|
Screen print Marking ink |
|
Screen printing and curing condition depend upon marking specification |
- 过程ATTENTION ON EACH PROCESS：
- Operation environment should be clean room of 20-25deg.C and 50-60%RH under yellow lamp (UV cut) avoiding fluorescent and sunlight.
操作环境为20- 25dec, 50-60%RH的洁净室，在黄灯下(紫外线切断)，避免日光灯和阳光照射。
- Open up the package when it becomes ambient temperature. Stir well before use.
常温下开罐使用，使用前应先搅拌均匀。
- Appropriate coating thickness on cupper circuits after thermal cure is 10um-20um. Thinner coating thickness may cause lower resistance in solder heat, chemical and Ni/Au plating. Thick coating may cause under cut and insufficient tackiness.
线路上涂层干膜厚度应在10 um-20um。薄涂层厚度可能会导致阻焊耐、化学镀镍/金性能下降。厚涂层可能导致侧蚀过大及附着力不足。
- Curing condition and window depend on oven type, batch size of work and curing condition of legend ink. Fink the optimum condition of your own
固化条件取决于烤箱类别，批量大小及油墨。客户应测试适合自己的最佳条件
- Exposure energy depends on material type of substrate or coating thickness. Find the optimum condition of your own based on resolution (undercut level), gross level, shoot-through, etc
曝光能量取决于基材类型和涂层厚度。找到自己的最佳条件，以达到最佳的分辨率。
- Control well the quality of developing agent in its density, temperature, spray pressure and dwelling time. Insufficient control may case deterioration in developing or under cut.
控制好显影液的浓度、温度、喷射压力和显影时间。控制不良可能导致显影不良侧蚀过大等。
- Set optimum curing condition and window with consideration of curing condition for legend ink. Shortage or excess cure may cause degrade of Coating properties.
设置最优的操作条件要注意油墨的固化条件。固化时间过长或不足都可能导致降低涂料的性能
- In case Ni/Au plating, set optimum curing condition and window with Consideration of curing condition for legend ink. Over curing cause lower Ni/Au plating resistance.
镀镍/金，设置最佳固化条件和显影条件。固化过度可导致抗镀镍/金性能下降。
四、特征CHARACTERISTICS
(1) 显影宽容度DEVEL OPMENT TOLERANCE WINDOW：
|
Drying time 固化时间 |
72deg.C 40 min |
72deg.C 50 min |
72deg.C 60 min |
72deg.C 70 min |
|
Developability 显影能力 |
Clean 干净 |
Clean 干净 |
Clean 干净 |
Slight Residue 轻微不净 |
(2)感度PHOTO SENSITIVITY ：
|
Item 项目 |
Thickness 厚度 |
Energy 能量 |
Developing time 显影时间 |
Sensitivity 感度 |
|
Sensitivity Kodak No.2 柯达2#感光尺 |
20±2um |
60mj/cm2) |
60 sec. |
8step |
|
80mj/cm2 |
9step |
|||
|
100mj/cm2 |
10step |
所需能量:40 – 100 mJ/cm2 ，ORC直接成像机（Di-IMPACT DXE-3512）(使用355nm以下的滤波器，by ORC Direct Imaging Mechanics， (Di-IMPACT DXE-3512)， (use cut filter below 355nm)。
- PROPERTIES 涂膜物性
|
ITEM 项目 |
TEST METHOD 测试方法 |
RESULT 测试结果 |
|
Adhesion 附着力 |
Coants Internal Test Method Cross hatch/Tape peeling 百格法/胶带剥离 |
100/100 |
|
Pencil hardness 铅笔硬度 |
Coants Internal Test Method No scratch on copper surface 铜表面上没有划痕 |
4H |
|
Solder heat resistance 耐热性 |
Rosin flux 260deg.C/10sec.1cycle Solder bath floating test 浮锡测试260℃*10秒*1次 |
Pass |
|
Solvent resistance 耐溶剂 |
PMA-AC, 20deg.C/20min.immersion Cross hatch/Tape peeling PGM-AC*20℃*20分钟 |
Pass |
|
Acid resistance 耐酸性 |
10vol% HCl, H2SO4, 20deg.C/20min.immersion, Cross hatch/Tape peeling |
Pass |
|
Alkaline resistance 耐碱性 |
10wt% Na OH, 20deg.C/20min. Immersion, Cross hatch/Tape peeling |
Pass |
|
Insulation resistance 绝缘电阻 |
IPC comb type B pattern 25-65deg.C,90%RH DC100V for 7 days Measurement：DC500V/1min. Value at room temperature |
Initial初始值 2.8*10×1013Ohm Conditioned终值 6.6×1012Ohm |
|
Dielectric constant 介电强度 |
25-65deg.C,90%RH DC100V for 7 days Measured at 1MHz/room temperature |
Initial初始值 4.3 Conditioned终值 4.5 |
|
Dissipation factor 介电常数 |
25-65deg.C,90%RH DC100V for 7days Measured at 1MHz/room temperature |
Initial初始值 0.030 Conditioned 终值0.042 |
|
Electroless Au plating 耐化学金性 |
Coants lab. Method Ni 3um/Au 0.03um |
Pass |
*All test data mentioned above in this technical data sheet are based on our laboratory test result and just for reference, not guarantee the same in your process.
以上所测数据是基于我们的实验室试验结果和参考，不能保证之用。
