TM-100 系列热固化字符油墨
热固化字符油墨 Thermal curable marking ink
TM-100 系列
TM-100系列是PCB板用双组份热固化字符油墨。使用图形网印刷，不干网，不渗墨，印字立体清晰，保色性能佳。对防焊、铜板及基材均有优良的附着力。低卤素，符合RoHS和REACH要求。
TM-100 series is a dual component thermal curable marking ink. Good printing ability, Excellent adhesion and Excellent Heat resistance. Non-Halogen and accord with RoHS and REACH
一、主要物性General properties
|
主剂Main agent |
TM-100 BK |
|
固化剂Hardener |
H-10A |
|
颜色Color |
黑色Black |
|
主剂粘度 Main agent’s Viscosity (at 25℃) |
300±20P |
|
混合比例Mixing ratio |
主剂Main agent：固化剂Hardener=9：1 |
|
混合后粘度 Viscosity after mixed (at 25℃) |
200±20dPa.s |
|
混合后固体含量 Non-volatile % after mixed |
78±3% |
|
混合后比重 Specific gravity after mixed |
1.4±0.05 |
|
保存期限Shelf life |
6个月/ 6 month after production |
|
包装规格Package |
1Kg/Cans（罐），10Kg/Box（箱） |
二、应用操作指引
|
防焊油墨至少150℃×20分钟以上 |
|
Solder mask curable more than 150℃×20 min |
|
↓ |
|
↓ |
|
油墨混合搅拌，10分钟以上至均匀 |
|
Ink mixing more than 10 min |
|
↓ |
|
↓ |
|
120T图形网，丝网印刷 |
|
120T graphics screen printing |
|
↓ |
|
↓ |
|
字符油热固化150℃×30分钟以上 |
|
Marking ink curable more than 150℃×30 min |
|
↓ |
|
↓ |
|
表面处理，抗氧化、喷锡、沉金或沉锡 |
|
OSP、HASL、EING or IMT |
三、涂膜特性PROPERRTIES（IPC-SM-840E）
|
要求Requirement |
测试方法Test Method |
结果Result |
|
防霉性Nonnutrient |
IPC-TM-650 2.6.1 |
OK |
|
表面状况Visual Requirements |
IPC-SM-840E 3.3.1 |
OK |
|
铅笔硬度Pencil Hardness |
ASTM D3363 |
OK |
|
附着力（硬板）Adhesion of RPB |
IPC-TM-650 2.4.28.1 |
OK |
|
可加工性Mach inability |
IPC-TM-650 2.4.7.1 |
OK |
|
耐溶剂和清洗剂 Resistance to Solvents and Cleaning Agents |
IPC-TM-650 2.3.42 涂膜无分离、裂纹、粘着 Coating shall not exhibit delamination, cracks, tackiness, swelling or permanent degradation |
OK |
|
耐化学试剂 Resistance to Assembly Processes and Chemistry |
IPC-SM-840E 3.6.1.2 10vol% H2SO4 20℃ 30min 10wt% NaOH 20℃ 30min |
OK |
|
水解稳定性 Hydrolytic Stability |
IPC-TM-650 2.6.11 |
OK |
|
可焊性Solder ability |
J-STD-003 260±5℃*10±1秒 |
OK |
|
耐焊性 Resistance to Solder
|
IPC-TM-650 2.6.8 Flux shall be a ROM0 or ROM1 per J-STD-004 助焊剂应依据J-STD-004，使用ROM0或ROM1 浮锡 Solder Float 260±5℃*10±1秒 |
OK |
|
Simulation of Lead Free Reflow 无铅回流焊模拟 |
IPC-SM-840E 3.7.3.1 浮锡Solder Float 260±5℃*10±1秒*5次 |
OK |
|
介电强度Dielectric Strength |
IPC-TM-650 2.5.6.1 |
1000 V DC/mil |
|
绝缘电阻Insulation Resistance |
IPC-TM-650 2.6.3.1 |
≧7.0×1012Ω |
|
耐湿绝缘电阻Moisture and Insulation Resistance |
IPC-TM-650 2.6.3.1 |
≧5.0×108Ω |
|
电迁移 Electrochemical Migration |
IPC-TM-650 2.6.14 |
OK |
|
冷热冲击Thermal Shock |
IPC-TM-650 2.6.7.3 -65℃ to +125℃ *100 Cycles -65℃ 到 +125℃ *100次 |
OK |
备注：此资料为本公司试验结果，不作为保证之用。适宜之条件，需参照操作指引，待贵公司实施确认后，再予以确定。This information is our test results, not as a guarantee. The suitable condition, need to consult Processing instructions, to be your company carry out confirmation, to be determined.
若英文内容与中文内容有差异，以中文为准。
In case of any discrepancy between the English and Chinese content, the Chinese version shall prevail.
