IJM-300 系列紫外光固化喷墨打印字符材料
紫外光固化喷墨打印字符材料 UV Curable Inkjet Marking mat
IJM-300 系列
IJM-300 系列 是我公司自主研发，拥有自主知识产权的UV固化喷墨打印PCB油墨，专利公开号：ZL201710940580.6。此产品采用国外进口原材料及生产检测设备，产品性能达到同类产品国际领先水平。产品特点有：
较低的UV能量可快速固化，可以LED光源固化。
较好的储存沉降稳定性、良好的喷墨稳定性。50℃条件下放置30天不返粗。
良好的表面硬度及阻焊性，表面硬度可以6H以上，良好的遮盖性和耐黄变性。
产品符合欧盟RoHS、REACH要求，环保无卤。
IJM-300 series is our own independent research and development（The patent publication number is ZL201710940580.6）, with independent intellectual property rights of UV curable Inkjet Marking ink for PCB, patent public CN107619824A. The products are imported from foreign raw materials and production testing equipment, and the product performance has reached the international leading level of similar products. The product features:
Fast curing and low energy requirement. LED light can be curing.
Good settling stability. Jet stability and low nozzle failure.
Excellent adhesion and hardness to fully cured solder mask. Opacity for the cured film and non-yellowing.
RoHS and REACH approved and Halogen-free.
一、物性General properties
|
1 |
型号Main agent |
IJM-300 WM01 |
|
2 |
颜色Color |
白色white黑色black |
|
3 |
比重Specific gravity |
1.20 |
|
4 |
表面张力Surface tension |
21-25mN/m at 20-25℃ |
|
5 |
保存期限Shelf Life |
6 months after manufacturing (Stored in cool and dark place at 10-20℃) |
|
6 |
包装规格Package |
1Kg/Cans（瓶），10Kg/Box（箱） |
|
7 |
粘度Viscosity (at 25℃) |
33-37cP (Brookfield 40# 80rpm, 25℃) |
|
8 |
粒径Grain dicmeter |
D50≤290nm 最大粒径≤700nm |
|
9. |
粘度温度曲线 |
激光粒径分析 |
|
10 |
|
 |
二、应用操作流程 Processing instructions
半固化阻焊工艺 semi-cured solder mask
|
阻焊层显影后线路板 |
|
after development of the solder mask |
|
↓ |
|
↓ |
|
喷印 + UV固化 UVA2：100-200mj/cm² UVV:200-500mj/cm² |
|
Jetting + UV curableUVA2: 100-200mj/cm2 UVV:200-500mj/cm² |
|
↓ |
|
↓ |
|
热固化150℃*60min |
|
Thermal curing 150℃*60min |
备注：我们推荐客户使用半固化阻焊工艺，不使用全固化阻焊工艺。
We recommend customers adopt semi-cured solder mask processing. We recommend customer use the
semi-cured solder mask processing, not the full -cured solder mask processing
三、制程注意事项attention on process
|
1、本公司喷印油墨，属纳米级产品。客户使用车间若洁净度不够，灰尘混入油墨中，可能导致喷头堵塞。产品在储存及使用过程中，都应特别注意防尘。 Keep the operation room cleaned. the product must be protected for dust.
2、喷印前的板子都应特别注意其洁净度，防止污染。若线路板本身已被污染，应采取措施进行处理，否则会影响喷印油墨的附着力等可靠性。 The contamination of board cause the quality and reliability deterioration.
3、工作洁净室的环境温度应控制在20-25度，湿度50-60%。 Operating in the clean room of the ambient temperature at 20-25℃/50-60%RH.
4、此油墨应在黄光灯下使用，避免阳光或紫外光直射。 Avoid direct exposure to UV and sunlight. Desirable to use ink in yellow lamps.
5、此油墨一般情况下不需要添加开油水可直接使用。不可以添加线路板厂常规开油水使用，若有特殊情况必须添加开油水时请与我司联系。 Desirable to use ink without dilution. When necessary, Inquire of ours. Because dilution may deteriorate the properties. In this case, solvent must not be applicable.
6、涂层厚度应控制在固化后10-20um为佳，若涂层太厚，容易开裂、附着力、耐化性变差及硬度下降。 Coating thickness should be controlled at 10-15um after curing is preferred. If the coating is too thick, it will be prone to cracking, poor adhesion, corrosion resistance and hardness.
7、固化条件，因设备光源不同，需咨询设备商，经过测试，找出合适的条件。固化条件不合适时，会引起涂层性能达不到产品预期效果。 As curing condition is variable depending on the type of lamps and the intensity of radiation, set it suitable to your process after testing. Curing condition out of the specified tolerance range may deteriorate the properties of resist coating.
8、清洁喷印头及喷印管道，请使用我司专用清洗液LN01清洁。 For cleaning ink jet head, please use our special cleaner LN01 . |
四、涂膜性能PROPERRTIES
|
要求Requirement |
测试方法Test Method |
结果Result |
|
防霉性Nonnutrient |
IPC-TM-650 2.6.1 |
OK |
|
表面状况Visual Requirements |
IPC-SM-840E 3.3.1 |
OK |
|
铅笔硬度Pencil Hardness |
ASTM D3363（0.5Kg） |
6H |
|
附着力Adhesion |
IPC-TM-650 2.4.28.1 |
OK |
|
Mach inability可加工性 |
IPC-TM-650 2.4.7.1 |
OK |
|
耐溶剂Solvents Resistance |
IPC-TM-650 2.3.42 涂膜无分离No peeling |
OK |
|
耐化学试剂 Acid & Alkaline Resistance |
IPC-SM-840E 3.6.1.2 10vol% H2SO4 20℃*30min 10wt% NaOH*20℃*30min |
OK |
|
水解稳定性Hydrolytic Stability |
IPC-TM-650 2.6.11 |
OK |
|
可焊性Solder ability |
J-STD-003 260±5℃*10秒*3次 |
OK |
|
耐焊性Resistance to Solder |
IPC-TM-650 2.6.8 助焊剂应依据J-STD-004，使用ROM0或ROM1 Flux shall be a ROM0 or ROM1 per J-STD-004 浮锡Solder Float 260℃*10秒*3次 |
OK |
|
Simulation of Lead Free Reflow 无铅回流焊模拟 |
IPC-SM-840E 3.7.3.1 Solder Float 浮锡260℃*10秒*5次 |
OK |
|
介电强度Dielectric Strength |
IPC-TM-650 2.5.6.1 |
1000 V DC/mil |
|
绝缘电阻Insulation Resistance |
IPC-TM-650 2.6.3.1 |
≧8.4×1011Ω |
|
耐湿绝缘电阻Moisture and Insulation Resistance |
IPC-TM-650 2.6.3.1 |
≧5.0×1011Ω |
|
电迁移Electrochemical Migration |
IPC-TM-650 2.6.14 |
OK |
|
冷热冲击Thermal Shock |
IPC-TM-650 2.6.7.3 -65℃ to +125℃ *100 Cycles -65℃ 到 +125℃ *100次 |
OK |
此资料为本公司试验结果，不作为保证之用。适宜之条件，需参照操作指引，待贵公司实施确认后，再予以确定。This information is our test results, not as a guarantee. The suitable condition, need to consult Processing instructions, to be your company carry out confirmation, to be determined.
若英文内容与中文内容有差异，以中文为准。
In case of any discrepancy between the English and Chinese content, the Chinese version shall prevail
